Industrial News

At the critical juncture where the global competition in the new computer industry enters uncharted waters in 2025, R&D has become the core element that defines a company's core competitiveness. ThinkView Technology has delved into the four major R&D pillars of "innovative design, craftsmanship in manufacturing; stability and reliability, superior value," constructing a full-stack technology system covering quantum computing, photonic computing, and intelligent hardware, reshaping the industry development pattern with its hard-core strength.

Innovative Design: Paradigm-Breaking Architectural Revolution

Innovative design is the core engine of ThinkView Technology's R&D. We aim to "disrupt performance boundaries and adapt to diverse scenarios" by creating generational advantageous technical architectures.

In the field of quantum computing, we have breakthroughly developed the "Aurora-III" thousand-qubit coherent photonic quantum computing architecture. This architecture, which employs a heterogeneous fusion design of spatial and fiber optic pathways, can achieve stable operation of 1,024 dedicated quantum bits without ultra-low temperature environments. The coupling precision reaches the int9 level, surpassing D-Wave's int5 standard. It has become the world's first thousand-qubit photonic quantum computing solution to achieve commercial deployment. The architecture's unique "dynamic error correction feedback mechanism" increases the quantum bit coherence time to 58 seconds, a thousand-fold leap from IBM's "Condor" at 70-80 microseconds. In drug molecule screening scenarios, it can compress the computational workload that would take traditional computers days to complete into milliseconds. Currently, this architecture has supported three of the world's top 10 pharmaceutical companies in completing the early-stage R&D of targeted drugs, with an efficiency increase of over 4,000 times.

In terms of photonic computing technology, we have launched the "Tai Chi-II" all-photonic heterogeneous computing architecture. This architecture integrates the dual technological advantages of silicon photonics and thin-film lithium niobate, achieving a modulation bandwidth of 120 GHz and linearity of 99.5% in the 1550nm wavelength band, breaking through the loss bottleneck of silicon-based materials. The architecture integrates 2,048 optical interference units, with energy consumption in the ResNet-18 task being only 1/12 of that of traditional electronic chips. The energy efficiency ratio reaches 210 TOPS/W, far exceeding the industry's mainstream level. In response to the training needs of large AI models, we have innovatively developed all-photonic backpropagation technology. Through coherent detection, it enables optical gradient calculation, reducing the inference latency of the BERT-Large task by 5.2 times compared to the H100 GPU. It has been deployed by China Merchants Bank for anti-fraud transaction processing, reducing the response latency to 0.28 milliseconds.

In the field of computing and networking integration, we have constructed a "photonic-electric-quantum" three-dimensional stacking architecture, deeply adapting to China Unicom's "all-photonic base 2.0" standard. It achieves latency coverage of 20ms between hubs, 5ms within hubs, and 1ms within cities. The architecture supports dual protection of quantum encryption and PQC encryption, enabling 100,000 encrypted transactions per second in financial trading scenarios. Meanwhile, through dynamic computing power scheduling technology, it increases the efficiency of distributed collaborative training to 92%, providing underlying support for cross-regional AI research and development.

Craftsmanship in Manufacturing: Precision Practice of Industry 4.0

If innovative design is the soul of technology, then craftsmanship in manufacturing is the carrier of quality. ThinkView Technology has built a full-chain quality control system from R&D to mass production according to the standards of a top-tier intelligent factory.

Our Suzhou intelligent manufacturing base was selected as a top-tier intelligent factory of the year in 2025. Through digital twin technology, it achieves virtual simulation of the entire process of design, production, and testing, identifying more than 85% of potential production issues in advance. In the quantum chip packaging workshop, 28 adaptive robots and 1,200 high-precision intelligent sensors are deployed to realize the full-process unmanned operation from wafer inspection to finished product packaging. The error in the heat sink and motherboard docking process is controlled within 0.05 millimeters, equivalent to 1/14 of the diameter of a human hair. Relying on this intelligent production line, the overall equipment efficiency (OEE) reaches 97%, an increase of 45% compared to traditional factories, with a stable product pass rate of 99.99%.

In the field of green manufacturing, we have pioneered a "liquid cooling + photovoltaic" collaborative energy-saving system. The PUE value of the all-optical server production workshop is as low as 1.12, with annual electricity savings equivalent to the annual usage of 52,000 households. By using biodegradable packaging materials and recycled metal components, carbon emissions in the production process are reduced by 62% compared to the industry average, having passed the LEED Gold certification and the EU CECP green manufacturing standards.

To meet customized demands, we have developed a flexible production system. Through AI-driven production scheduling algorithms, we can quickly switch between different product models in 45 minutes, which is 50% shorter than the industry standard. We have now established a mass production model of "standardized modules + customized interfaces," capable of simultaneously meeting the personalized needs of eight major fields, including finance, healthcare, and intelligent manufacturing. The delivery cycle for customized orders has been compressed to within 15 days.

Stability and Reliability: Performance Verification in Extreme Scenarios

Stability and reliability are the core guarantees of technological value. We ensure the continuous operation of products in extreme environments with a testing system that far exceeds industry standards.

In the field of electrical safety, we fully comply with the latest IEC 62368-1 standard and establish a seven-level safety testing system. All server products pass the 4kVdc reinforced insulation withstand voltage test, the 30A/120-second grounding impedance test (impedance value ≤80mΩ), the 500Vdc insulation impedance test (≥5MΩ), and the 264Vac contact current test (≤3mA), obtaining a "zero-defect" certification in third-party testing. For high-load data center scenarios, we have developed intelligent thermal equilibrium technology. Through 128 temperature sensors, it regulates heat dissipation in real-time, enabling equipment to run continuously for 10,000 hours without failure at 100% load, with an MTBF (mean time between failures) of over 1.5 million hours.

Extreme environment adaptability testing covers a temperature range of -40℃ to 70℃, a humidity range of 10% to 95%, and peak vibration conditions of 10G, simulating special scenarios such as plateaus, oceans, and deserts. In the Qinghai-Tibet scientific expedition project, our low-power computing terminal stably operated for 18 months at an altitude of 5,200 meters and -35℃, maintaining a data transmission accuracy rate of 100%. The anti-interference computing device customized for a maritime satellite project can withstand electromagnetic interference in a 15-level typhoon environment.

In terms of service reliability, we have built a "global 12-hour response circle." Through the predictive maintenance module embedded in the equipment, we can warn of potential failures 72 hours in advance, reducing unplanned downtime to less than 0.5 hours per year. In the first half of 2025, the equipment failure rate for financial industry customers was only 0.008%, and the average trouble-free running time of medical imaging workstations exceeded 200,000 hours, ranking first in the global industry.

Superior Value: The Cost-Performance Revolution Breaking Barriers

The ultimate value of technology lies in its widespread application. We have achieved the unity of "high performance and low cost" through architectural optimization and supply chain integration.

Addressing the pain points of AI transformation for small and medium-sized enterprises, we have launched the "inclusive AI computing power terminal" series. By adopting the neuromorphic heterogeneous computing architecture (NHCA) and a localized supply chain, we have increased AI inference performance to 1850 TOPS while reducing the price by 50% compared to competitors. For example, a certain electronic manufacturing company deployed 10 of these terminals to replace traditional GPU workstations, reducing the initial investment by 68%. The equipment investment payback period is only 2.8 months, with a 3-year ROI exceeding 3200%. In the LLaMA 11B inference test, the terminal achieved a processing speed of 342 tokens/s, an 85% increase compared to similar products, becoming the first enterprise-level AI computing power device to enter the "ten-thousand-yuan level."

In the high-end market, our quantum-all-optical fusion server customized for JPMorgan's financial risk control solution has increased transaction risk identification efficiency by ten times, reducing bad debt losses by over 1.0 million US dollars per year, while saving 30% on comprehensive procurement costs compared to international competitors. The AI medical imaging computing platform we created for Mayo Clinic has increased breast cancer screening accuracy to 98.7%, shortened the diagnosis time from 40 minutes to 3 minutes, and reduced the total cost of equipment ownership by 45%.

We have established a "full life cycle value service system." Through value-added services such as remote diagnosis, spare parts pre-positioning, and technology upgrades, we have maintained a 3-year equipment value retention rate of over 65% for our customers, which is 20 percentage points higher than the industry average. We have also launched a "trade-in + performance upgrade" plan for old customers, helping over 100 companies to iterate their equipment and extending the effective service life of each device by an average of more than three years.

Conclusion: Defining the Future of the Industry with Technological Strength

From the stable operation of thousand-qubit quantum computing to the energy efficiency breakthrough of all-optical architecture, from the precision manufacturing of top-tier intelligent factories to the reliable verification in extreme scenarios, ThinkView Technology has built an irreplicable technological barrier with its R&D philosophy of "innovative design, craftsmanship in manufacturing, stability and reliability, superior value." As of Q3 2025, the company has accumulated 386 invention patents, led or participated in the formulation of 12 international industry standards, and achieved a technological transformation rate of 91%, serving over 50 Fortune 500 customers.

In the future, we will continue to invest 18% of our revenue in R&D, focusing on cutting-edge directions such as the large-scale integration of qubits, all-optical general computing, and green computing power. We will bring high-performance computing technology from the laboratory to the front line of the industry, transforming it from a tool exclusive to giants to an inclusive instrument. We will drive the intelligent upgrade of the global industry through technological innovation.