Industrial News

In the race of the new computer industry in 2025, ThinkView Technology has built a full-stack technological competitiveness with the R&D principles of "innovative design, craftsmanship in manufacturing; stability and reliability, superior value," defining a new industry benchmark with its hard-core strength.

Innovative Design: Architectural Breakthroughs Lead the Computing Power Revolution

We break through the performance ceiling with architectural innovation, achieving dual breakthroughs in photonic quantum and all-optical computing. Our independently developed "Aurora-III" photonic quantum computing architecture, with a core of thin-film lithium niobate photonic chips, achieves stable operation of 64 logical qubits at room temperature, with a quantum coherence time of 58 seconds, a thousandfold increase compared to the industry's mainstream level. In response to the computing power needs of large AI models, we have launched the "Tai Chi-II" all-optical heterogeneous architecture, integrating silicon photonics and three-dimensional optical technology. In the ResNet-18 task, it achieves an energy efficiency ratio of 210TOPS/W, seven times that of GPUs, and reduces the inference latency of BERT-Large by 5.2 times. It has been applied in China Merchants Bank's real-time anti-fraud scenarios. This dual-technology layout of "quantum + photonics" makes us one of the few companies in the world that can provide multi-scenario computing power solutions

Craftsmanship in Manufacturing: Precision Control Strengthens the Quality Foundation

Relying on the first photonic chip pilot line in China and the digital twin intelligent factory, we integrate precision and efficiency into the entire manufacturing process. The quantum chip packaging workshop uses adaptive robots and thousand-level high-precision sensors to achieve assembly error control at the 0.05-millimeter level, with an overall equipment efficiency (OEE) of 97%. The all-optical server production line is equipped with a "liquid cooling + photovoltaic" collaborative system, with a PUE value as low as 1.12, 40% lower than the industry average, saving electricity equivalent to the annual usage of 52,000 households. Through the "standardized modules + flexible interfaces" model, the delivery cycle for customized orders is compressed to 15 days, meeting the personalized needs of eight major fields, including finance and healthcare.

Stability and Reliability: Extreme Verification Guards Operational Safety

We ensure product resilience with a testing system that far exceeds industry standards. The full series of servers pass the wide temperature test from -40℃ to 70℃ and the 10G peak vibration verification, with the mean time between failures (MTBF) breaking through 1.5 million hours, a 50% increase compared to the international standard. In the Qinghai-Tibet scientific expedition project, low-power computing terminals stably operate for 18 months at an altitude of 5,200 meters and -35℃, with a data transmission accuracy rate of 100%; the anti-interference equipment customized for maritime satellites can withstand electromagnetic interference in a 15-level typhoon, with an extreme scenario protection rate of 100%.

Superior Value: Full-Chain Empowerment Creates Customer Value

We achieve a precise balance between high performance and high cost-effectiveness. The inclusive AI computing power terminal launched for small and medium-sized enterprises, using a neuromorphic heterogeneous architecture, reduces the price of a 1850TOPS computing power device by 50%, with an investment payback period of only 2.8 months. The quantum financial risk control solution customized for JPMorgan increases transaction risk identification efficiency by ten times, saving 30% on comprehensive costs; the AI imaging computing platform created for medical customers shortens the diagnosis time from 40 minutes to 3 minutes, reducing the total cost of ownership by 45%. Through the "trade-in + upgrade service" plan, the three-year equipment value retention rate reaches 65%, far exceeding the industry average level.

As of Q3 2025, the company has accumulated more than 100 invention patents, led the formulation of eight international standards, and achieved a technological transformation rate of 91%. ThinkView Technology will continue to use R&D as the engine to turn innovative design into quality products and convey the value of technology through craftsmanship in manufacturing.