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In 2025, with AI large models' parameters breaking through the trillion level and the industrial Internet entering the real-time decision-making phase, the "memory wall" and "power consumption wall" faced by the traditional von Neumann architecture have become the core bottlenecks for industrial upgrading. Computing technology is experiencing a key turning point from single-point breakthroughs to systemic changes. The integration of quantum and classical computing, the collaboration of photonic and electronic computing, and the unification of storage and computing together outline the development blueprint for the next generation of computing technology. This paper combines cutting-edge practices and industry insights to deeply analyze the four core development trends in the field of new computer technology.

Architectural Revolution: Diverse Breakthroughs Breaking the von Neumann Shackles

The physical separation of storage and computing in traditional computing architecture has led to a continuous increase in the proportion of latency and energy consumption caused by data movement. In AI inference scenarios, this loss has exceeded three times the energy consumption of computing itself. In 2025, architectural innovation has become the core means of breaking through performance bottlenecks, presenting the distinct characteristics of "storage and computing integration dominance and variable structure adaptation."

Storage and computing integration technology has moved from proof of concept to large-scale commercial use. The global market size is expected to exceed 12 billion US dollars in 2025, with Chinese enterprises contributing 30% of the technical patents and production capacity. By integrating computing units into the storage array, this technology allows data processing and storage to be completed in the same physical space, reducing power consumption by more than 70% and data movement latency by 90%. The industry has formed a clear technological route differentiation: near-memory computing, represented by AMD's Zen series CPU and Tesla's Dojo, achieves efficient collaboration through the close layout of computing modules and storage arrays, compatible with existing software ecosystems; in-memory computing, on the other hand, completely breaks through architectural boundaries. ZhiCun Technology's chip based on Flash media has achieved mass production in intelligent voice scenarios, and HouMo Intelligence's storage and computing integration smart driving chip has a physical computing power of 256TOPS and will be equipped in mass-produced vehicles in 2025. Technological breakthroughs are concentrated in three directions: adopting new storage media such as RRAM and MRAM to improve computing accuracy, using 3D integration technology to increase computing power density to 1000 TOPS per cubic centimeter, and developing dedicated compilers to solve model adaptation difficulties.

Generative variable-structure computing has become another important direction for architectural innovation. The core logic is to allow the computing system to dynamically adjust hardware configuration like a "Transformer" according to tasks. The Q.ANT photonic native processing server launched in 2025, based on thin-film lithium niobate chips, achieves nonlinear computing architecture reconstruction. It can reduce 40-50% of the computing workload for AI inference and automatically switch to an efficient parallel mode for physical simulation. This architectural innovation enables a single device to meet the full-scene needs from low-power edge-end inference to large-scale cloud training. In financial risk control scenarios, it has achieved dynamic balance between performance and energy efficiency.

Computing Power Leap: Synergistic Breakthroughs of Quantum and Photonic Computing

As traditional chip processes approach the 3nm physical limit, quantum computing and photonic computing have become the two core engines for exponential growth in computing power. In 2025, both have made the key leap from laboratory to industrial application.

The quantum computing field has witnessed the "maturity of error correction technology," a historic breakthrough. Companies like IBM and Google have achieved a scale of over 800 quantum bits with error rates reduced to below the commercial threshold. The technological route presents a pattern of "parallel development of general-purpose and special-purpose." General-purpose quantum computers focus on the scaling of superconducting qubits, while special-purpose quantum computers have achieved commercial landing first in the photonic quantum route. Bose Quantum's 1000 special-purpose quantum bits coherent photonic quantum computer can stably operate for more than 12 hours at room temperature. Its QBM-VAE model based on the quantum Boltzmann computer has shortened the drug molecule screening cycle by 70% and increased the accuracy in protein structure prediction to 92%. Applications have expanded from the scientific research field to actual industries. JPMorgan is testing quantum algorithms to optimize investment portfolios, and three of the world's top 10 pharmaceutical companies are using quantum computing to accelerate targeted drug research and development, verifying the exponential acceleration advantage of quantum computing in specific problems. It is worth noting that "quantum-supercomputing-AI integration" has become a new trend. By solving combinatorial optimization problems with quantum computing, high-precision simulations with supercomputing, and pattern recognition with intelligent computing, the three have achieved a 40% accuracy improvement in weather forecasting.

Photonic computing, with its inherent advantages of high parallelism and low energy consumption, has become the core technological path to break through the "power consumption wall." Its core principle is to use the multi-dimensional information of light's wavelength, phase, polarization, etc., for parallel computing, with an energy efficiency ratio 100-1000 times higher than traditional electronic chips. In 2025, technological breakthroughs have been concentrated in three dimensions: Tsinghua University's "Tai Chi" photonic chip has achieved an energy efficiency ratio of 182TOPS/W, far exceeding the most advanced GPU's 30TOPS/W; Q.ANT's thin-film lithium niobate photonic chip has achieved 99.7% precision for 16-bit floating-point operations, solving the long-standing precision problem in photonic computing; a Chinese team's photonic convolution processor has increased image recognition energy efficiency by 200 times and has been applied to satellite real-time image analysis. The integration of photonic computing and AI is particularly noteworthy. In the ResNet-18 image recognition task, the photonic processor's energy consumption is only 1/9 of that of electronic chips, and inference latency is reduced to the microsecond level, providing ideal computing power support for real-time scenarios such as autonomous driving and industrial quality inspection.

Green Evolution: Full-Chain Innovation of Sustainable Computing

As global data centers' annual electricity consumption approaches 4% of the world's total electricity usage, green and low-carbon has been upgraded from a compliance requirement to a core competitiveness. In 2025, sustainable computing technology has achieved a systemic breakthrough from single-point energy saving to full life cycle carbon reduction, forming a three-dimensional development model of "hardware energy efficiency optimization + intelligent scheduling energy saving + circular technology implementation."

Liquid cooling technology has become a standard for high-density data centers, completely changing the traditional air cooling heat dissipation logic. Based on the physical characteristic that liquid's specific heat capacity is 4000 times that of air, liquid cooling technology has achieved 100% heat capture efficiency, increasing the single cabinet power density from 15kW in the air cooling era to 120kW. The industry has formed a dual-route parallel pattern: cold plate liquid cooling, with a 40-60% cost advantage for transformation, occupies 90% of the market share. HPE's cold plate whole cabinet solution achieves 75-80% heat source coverage, suitable for existing data center upgrade needs; immersive liquid cooling aims for extreme energy efficiency. Alibaba Cloud and Intel's single-phase immersion solution reduces PUE to 1.09, and HPE's phase change immersion solution further compresses PUE below 1.1, supporting the stable operation of 1376W high-power chips. Technological innovation focuses on three directions: improving coolant compatibility, intelligent leak detection, and simplifying maintenance processes, promoting liquid cooling technology from high-end customization to large-scale popularization.

On the basis of hardware innovation, intelligent scheduling and circular technology further explore carbon reduction potential. AI optimization algorithms have achieved dynamic allocation of computing power, automatically adjusting hardware power consumption status according to load changes, reducing overall data center energy consumption by 40%. More revolutionary is the emergence of carbon capture computing clusters, which use the residual heat of computing devices to drive carbon adsorption devices, achieving active carbon reduction during operation. At the device level, biodegradable chip substrates achieve complete soil decomposition within 6 months, and the proportion of recycled metal in server manufacturing increases to 35%, reducing the generation of electronic waste from the source.

Ecosystem Integration: The Last Mile of Technology Implementation

In 2025, the competition focus of new computing technology has shifted from single hardware performance to the ecological collaboration ability of "hardware-software-scene." Three major integration trends accelerate the commercial implementation of technology.

Hardware-software collaboration is moving towards deep customization, breaking the traditional passive mode of "software adapting to hardware." In the field of quantum computing, Bose Quantum's open-source quantum-native AI training suite based on the PyTorch ecosystem allows developers to build applications without a background in quantum physics, with the platform's cumulative call volume exceeding 68 million times; in the field of photonic computing, Q.ANT's photonic server supports mainstream frameworks such as TensorFlow and Keras, achieving seamless connection with existing data centers through the PCIe 6.0 interface. This ecological adaptation reduces the application threshold of new computing technologies by 80%, and

the number of developers has tripled within a year.

The "computing + industry" scenario integration has given birth to a large number of killer applications. In the medical field, neuromorphic chips reduce the signal processing delay of brain-computer interface devices to 8 milliseconds, with a 95% accuracy rate for decoding the movement intentions of Parkinson's patients; in the industrial field, storage and computing integration edge chips achieve a 0.3-second response for equipment vibration monitoring, with a fault prediction accuracy rate exceeding 93%; in the financial field, the quantum-classical hybrid architecture reduces anti-fraud transaction processing delay to 0.28 milliseconds, while ensuring data security through fully homomorphic encryption. These scenario innovations have verified the commercial value of new computing technologies, pushing industry penetration rates from 5% in 2024 to 18% in 2025.

Cross-technology domain integration has become a new trend, with combinations such as "quantum + AI" and "photonic + storage and computing" continuously emerging. Bose Quantum's quantum neural network has solved the problem of high training complexity in traditional Boltzmann machines, increasing accuracy by 23% in genomics research; AI servers based on the "photonic computing + storage and computing integration" architecture have achieved dual breakthroughs in energy efficiency ratio and real-time performance, increasing traffic efficiency by 40% in smart city traffic control. This integrated innovation is building a new computing technology system, providing better solutions for complex problems.

Conclusion: Building the Technical Foundation for the New Era of Computing Power

In 2025, new computer technology is experiencing a shift in thinking from "pursuing extreme performance" to "achieving precise adaptation." The four major trends of architectural innovation, computing power leap, green evolution, and ecosystem integration are intertwined, jointly promoting computing technology into a new era of diversified collaboration. From thousand-qubit quantum computers operating at room temperature to liquid-cooled data centers with a PUE below 1.1, from storage and computing integration edge terminals to photonic-driven AI inference servers, technological breakthroughs are no longer isolated single-point innovations but have formed a mutually supportive and co-evolving technical ecosystem.

For the industry, the key to grasping these trends lies in balancing three relationships: the balance between technological advancement and commercial feasibility, the balance between single-point performance and system energy efficiency, and the balance between independent innovation and ecosystem openness. ThinkView Technology is deeply deploying the four major technical trends with its "Aurora" quantum computing architecture, "Tai Chi" photonic computing chips, and full-stack liquid cooling solutions at the core. Through the full-chain capability of "hardware foundation, software empowerment, and scenario implementation," it helps global customers seize the historical opportunity of the computing power revolution.

The future is here. The next leap in computing technology will surely be born from breakthroughs in architectural innovation, the evolution of computing power forms, the practice of green development, and more importantly, the deep integration with various industries.